请帮忙翻一下 要人工翻译3.1 Analysis of flow stress during thixotropiccompressive deformation processThe stress-strain curves of semi-solid SiCp/AZ61composites with various volume fractions of SiCparticles are shown in Fig.3. The tendency o

请帮忙翻一下 要人工翻译3.1 Analysis of flow stress during thixotropiccompressive deformation processThe stress-strain curves of semi-solid SiCp/AZ61composites with various volume fractions of SiCparticles are shown in Fig.3. The tendency o
请帮忙翻一下 要人工翻译
3.1 Analysis of flow stress during thixotropic
compressive deformation process
The stress-strain curves of semi-solid SiCp/AZ61
composites with various volume fractions of SiC
particles are shown in Fig.3. The tendency of curves
implies that the deformation temperature has a
significant effect on the flow stress. It is observed that
for a constant strain rate and constant volume fraction of
SiC in the composites, the flow stresses and peak stresses
decrease with the increasing of deformation temperature,
which presents that the thixotropic plastic deformation of
the composites is highly sensitive to temperature. The
tendency is thought to be the result of variation of
volume fractions of solid α phase. When the specimens
have high solid volume fractions, the solid grains contact
with each other and form a net, sliding and rotation of
grains become hard. The plastic deformation of solid
particles is the main mechanisms. With the increasing of
temperature, the solid volume fractions decrease, and the
solid grains are surrounded by liquid phase, which makes
the solid grains to slide and rotate easily. Thus the sliding
and rotation of grains plays a more significant role in the
thixotropic plastic deformatioThe relationships between peak stress and
temperature of composites with strain rate of 10 s−1 are
shown in Fig.4. It can be seen that the variation of
volume fractions of SiC also has a significant effect on
the peak stress of the composites. When the deformation
temperature rises slightly higher than the solid phase line
in semi-solid zone, the volume fractions of liquid phase
is low in the matrix, and the peak stress decreases rapidly
almost as linear form with the increasing of temperature
initially, and then slows down as the temperature
increases further. The results are thought to be of the
lower volume fractions of liquid phase

请帮忙翻一下 要人工翻译3.1 Analysis of flow stress during thixotropiccompressive deformation processThe stress-strain curves of semi-solid SiCp/AZ61composites with various volume fractions of SiCparticles are shown in Fig.3. The tendency o
在流动触变应力分析中,压缩变形过程半固态SiCp/AZ61的应力应变曲线各种复合材料的SiC体积分数颗粒见图3.曲线的趋势意味着变形温度有显着影响的流动应力.据观察,在恒定应变速率和恒定体积分数碳化硅复合材料中,流动应力和应力峰值降低与变形温度的升高,它提出了触变塑性变形复合材料对温度非常敏感.该倾向被认为是变异的结果固相体积分数的α.当标本具有高固相体积分数,固体颗粒的接触彼此形成一个网络,滑动和旋转谷物变硬.塑性变形的固体颗粒的主要机制.随着越来越多的温度,固相体积分数减少,而固体颗粒的四周都是液相,这使得固体颗粒的滑动和旋转容易.因此,滑和粮食轮换中起着更重要的角色触变应力峰值之间的关系和塑料deformatioThe复合材料的低温和应变为10 s - 1的速率图4所示.可以看出,变异 SiC的体积分数也有显着影响该复合材料的应力峰值.当变形温度升高略低于固相线高在半固态区,液相的体积分数在基体低,且应力峰值迅速下降几乎是线性的形式随温度的升高最初,然后随着温度的减慢进一步增加.结果被认为是对液相体积分数较低